Grinding and Polishing Manufacturer

Grinding and polishing involve a step-by-step reduction of the roughness of a surface to access the undeformed structure. Grinding uses fixed abrasives—the abrasive particles are bonded to the paper or platen—for fast stock removal. Polishing uses free abrasives on cloth; the abrasive particles are suspended in a lubricant and can roll or slide across the cloth and specimen. This process is based on using abrasive particles in progressively finer grain sizes. In materialographic grinding, these abrasives are bonded in resin or metal matrix, with the most frequently used grinding abrasives being silicon carbide particles. These particles are often used when working with softer, medium or hard materials, composites and electronics. It is also possible to utilize diamond particles for harder components like ceramics, carbides, glass or stone.